摘要
概述了附载体极薄铜箔和附树脂极薄铜箔制造工艺,特别适用于制造高密度超精细线路的多层板。
This paper Summarizes the manafacturing process of carrier-coated thinnest copper foil and resin-coated thinnest copper foil. It is suitable to manufacturing high density and superfine pattern printed wiring board specially.
出处
《印制电路信息》
2003年第12期36-40,共5页
Printed Circuit Information
