Cu/Ni纳米迭层膜的电沉积制备

Preparation of Cu/Ni Nanometer Multilayer Films Obtained by Electrodeposition

本文用脉冲渐变电位沉积法，在黄铜基体上沉积出一系列Cu／Ni纳米迭层膜，用扫描—能谱仪，X—射线衍射仪，及俄歇能谱仪对这层膜的成分及结构进行了分析：还对镀液组成及电流密度等工艺参数对选层膜成分的影响进行了初步探讨。

A series of CulNi nanometer multilayer films on brass substrate were obtained by means of gradually alternate pulse potential electrodeposition. The composition, lnicrostructure of these films were analyzed.The effect of the composition of electroplating solutions and current density on the composition of multilayer films was discussed.