沉积方式与基体材料对TiN薄膜内应力的影响

EFFECTS OF DEPOSITION AND SUBSTRATE ON THE EVOLUTION OF INTERNAL STRESS IN TiN FILMS

本文研究了TiN薄膜在化学气相沉积、物理气相沉积(包括热灯丝离子镀和多弧离子镀)以及等离子增强化学气相沉积等不同生成条件下的内应力变化。并通过改变钢及硬质合金基体的化学成份和表面状态。考察了基体材料对薄膜应力的影响。在此基础上,对薄膜内应力的形成机制进行了分析讨论。

The variation of internal stresses in CVD, PVD and PCVD TiN films are investigated on steel and cemented carbide substrates with different chemical compositions and mechanical surface states. The results indicate that the stresses will reach different values for the films deposited with different processes, but the effect of the chemical composition of substrate with the same type (say, steel or cemented carbide) appears to be weak for the stress development. In every case, the stress value decreases for the substrates being sand-peened and increases for those being ground. Based on the results the evolution mechanism of thermal and intrinsic stresses during film deposition is discussed.