4PIETSCH G J, KERSTAN M. Understanding simultaneous double disk grinding:opearation and material removal kine- matics in silicon wafer planarization[ J]. Precision Engineer- ing,2005,29(2) :189 - 196.
5ZARUDI I, HAN B S. Deformation and material removal rate in polishing silicon wafers [ J ]. Journal of Materials Process- ing Technology, 2003 ( 140 ) : 641 - 645.
