摘要
本文建立了多层印刷线路板热力分析工程计算的数学模型,并已发展成一种广为应用的工程软件。
It is created that the mathematical modelling of numerical thermal analysis for multi-printed circuit board using in engineering. The useful software in engineering have been deve-olped.
关键词
印刷线路板
传热
数学模型
printed circuit board or printed wiring board
numerical thermal analysis
