摘要
金刚石和碳化硅的热特性及电特性决定了它们在电子器件半导体材料中具有最高的材料优质系数，特别适用于在高温环境中应用。本文重点或介绍了金刚石、ＳｉＣ的材料特性、薄膜生长技术和最近器件的研究结果，同时给出了目前存在的问题及解决这些问题的方法。
The thermal and electron properties of diamond and silicon carbideprovide the highest figures of merit for any semiconductor materials which areused in electronic devices, They are suited for high temperature applications.The characteristics of diamond and SiC, the technology of the film growth, andthe results of recent device development are emphasized in the paper.Someproblems encountered and suggestions for future research are also discussed.
出处
《半导体情报》
1994年第2期46-56,共11页
Semiconductor Information
关键词
高温半导体
金刚石
碳化硅
igh temperature semiconductor, Diamond, SiC
