摘要
介绍了在Si ̄+注入的n-GaAs沟道层下面用Be ̄+或Mg ̄+注入以形成p埋层。采用此方法做出了阈值电压0~0.2V,跨导大于100mS/mm的E型GaAsMESFET,也做出了夹断电压-0.4~-0.6V、跨导大于100mS/mm的低阈值D型GaAsMESFET。
A p buried layer formed by implanting Be ̄+or Mg ̄+ in n-GaAs chan-nel layer with Si ̄+ implantation is presented. Using this method, we have ma-nufactured E type GaAs MSEFET with its threshold voltage of 0~0. 2V, and transconductance greater than 100mS/mm.A low threshold D type GaAs MESFET with pinch voltage of-0.4~-0. 6V and transconductance greater than 100mS/mm has been achieved.
出处
《半导体情报》
1994年第6期12-15,共4页
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