摘要
分析热熔胶和热熔系统产生的原因、特性,介绍其在包装中的应用,并着重分析其在包装应用中存在的问题及解决的办法,最后介绍了它们的发展趋势。
The reasons and the propeties caused by hot melt adhesive and hot melt system are analyzed. APplications of them to the package are introduced. Problems existing in the applications of them to the package and solving methods are mainly analyzed. At last development trands of them are discribed.
出处
《包装工程》
CAS
CSCD
1994年第5期193-198,共6页
Packaging Engineering
关键词
热熔胶粘剂
热熔系统
包装
Hot Melt Adhesive Adhesive Hot Melt System Package Environmental Protection