小尺寸物体自然对流换热的数值模拟

Numerical Simulation of Natural Convection Heat Transfer from small Size Objects

本文将三维附面层方程抛物型化，对不同尺寸的等温小加热块自然对流换热进行了数值模拟，并用来研究微电子集成电路芯片的冷却问题．

In order to study the heat transfer problem of microelectronic integratad circuit chips, numerical simulation of natural convection from constant temperature small size objects is carried out. The parabolized three-dimensional laminar boundary-layer equations are used to describe the flow and heat transfer phenomena.