无氰化学镀金镀速及稳定性的研究

Study on Plating Rate and Stability in Cyanide Free Bath of Electroless Gold Deposition

介绍了以硫脲作为还原剂,亚硫酸钠作为络合剂的化学镀金溶液,研究了其镀速和稳定性与各因素的关系,得出比较满意配方和工艺条件,其镀液稳定,镀速可达4μm/h.

The electroless gold deposition bath was studied using thiourea as the reducing agent and sodium sulphite as the complexing agent. The relations between the plating rate, stability and the factors in plating bath had been developed. The bath solution and technology were both satisfactory, and the plating rate could attain to 4μm/h.