摘要
介绍了新型可焊性锡铈铋镀层电镀工艺的镀液配方和电镀操作条件;测试了镀液的分散能力、阴极电流效率和沉积速率.用铜丝或铜片作镀件,在小槽内电镀,获得的镀层,外观致密均匀,似镜面光亮,结合力强.
The bath formuler and the technological conditions of new weldable Sn-Ce-Bi plating are introduced. The dispersive capasity, the cathode current effeciency and the deposition rate are tested. A mirror glossy film on the copper wire or steel sheet is obtained. The uniform and compact film has strong binding force.
出处
《表面技术》
EI
CAS
CSCD
1994年第1期34-36,共3页
Surface Technology
