陶瓷钎焊的研究

STUDY OF CERAMICS BRAZING

研究了Ａｌ＿２Ｏ＿３、９３％Ａｌ＿２Ｏ＿３、Ｓｉ＿３Ｎ＿４和ＺｒＯ＿２陶瓷与陶瓷、陶瓷与不锈钢活性钎焊。结果表明：用Ａｇ－Ｃｕ－Ｔｉ活性钎料直接钎焊陶瓷与陶瓷可获得良好的接头强度；Ｃｕ缓冲层明显影响陶瓷与不锈钢钎焊接头强度。当不加缓冲层或缓冲层太薄（≤０．０５ｍｍ），焊后不能完整存在而不能有效缓和接头残余应力时，接头有效强度较低；当缓冲层较厚（０．１和０．３ｍｍ）时，可获得高的接头强度。

The active brazing of ceramics(Al_2O_3,ZrO_2andSi_3N_4)to ceramics and to 18-8 stainless steel was performed using Ag-Cu-Ti filler in a vaccum.The effects of buffer layer Cu on thejoining strength of ceramics to stainless steel were investigated.It was shown that the excellent strength of ceramics to ceramicscould be obtained.The buffer layer Cu had a considerable influenceon the strength of ceramics to stainless steel joints.Without the buffer layer or when it was too thin(≤0.05mm), the joining strength was low because a large amounts of copper dissolved into the filler metal and could not sufficiently relax the interfacialstress arisen from the difference of thermal expansion coefficient between ceramics and steel, and when the thickness of Cu was0.1mm or 0.3mm,the joint strength of ceramics to steel couldbe improved.