RF溅射Ta－10W合金薄膜性能与沉积参数的关系

RF SPUTTERING Ta-10W ALLOY FILMS PROPERTIES AND DEPOSITION RATE

利用ＲＦ溅射技术在ＰＣｒＮｉ２ＭｏＶＡ基上沉积Ｔａ－１０Ｗ合金薄膜，利用扫描电镜等分析手段研究了薄膜的沉积速率、断口的组织形貌与沉积参数之间的关系。结果表明，沉积速率随功率的增加而线性增加，随Ａｒ气压强的增加呈非线性增加，基底无论加正偏压还是加负偏压都使沉积速率下降。薄膜的组织形貌随Ａｒ气压强的增加由纤维组织变为粗大锥状晶。气压越高，组织越粗大，孔洞尺寸也越大。基底加偏压使组织细化。

The Ta-10W alloy films on P30CrNi2MoVA have been deposited by R. F sputtering technique. The relationships between deposition rate,coating fracture cross sections and deposition conditions have been carefully investigated by SEM and so on.Results indicate that the deposition rate increases linearly with power and nonlinearly with pressure,decreases with substrate bias.The transition zone of tightly packed fibrous grains would change to rough tepered crystallites separated by voids. Higher the pressure. rougher the fracture cross sections. No significant power influence was found on the fracture cross sections,but significant bias influence was done.The fracture cross sections become dense and fined under bias.