关于粘结构造体缺陷部检测方法的研究

Detection of Defective Adhesion Parts in Adhesive Bonded Structure by Impact Hammer

本研究是介绍一种非破坏检测的新型方法，即用一种带有压电晶体的激振器的装置系统，对粘结构造体进行打击时，可以简单地检测出粘结剂层中的空隙、龟裂等各种粘结缺陷部份．本文对这种有效的非破坏检测方法的基本特性进行了论述．对于粘接构造体的基本要素之一的试件采用了两种测量方法。第一种方法是通过比较激振力的时间幅值可以检测出粘接部的缺限的位置及大小．第二种方法是首先打击试件，同时测出激振力和试件的振动状态，从这两种信号计算试件的振动状态．振动状态的结点与粘接部和空陷部的界面大体上相一致．实验结果证明这种方法可显示出检测精度与粘接剂，被粘结体的厚度以及缺陷的大小，粘接剂硬度的关系．

This report treats with the fundamental characteristics of the simple and useful non break down test,which is based on hitting the adhesive bonded structure by impact hummer with.Piezo electric element and is used to detect defective adhesion parts such as voids and cracks in adhesive layer. Two measurement methods have been applied for test pieces adopted as a basic element of adhesive bonded structure. One makes it possible to detect the position and scale of defective adhesion parts by comparing with the time whidths of impulse forces. Other utilizes the characteristics that adhesion-defection interface nearly coincides in node of the modal vibration shape of test piece, which is computed from both signals of the impulse force and the vibration of test piece measured at the same time in hitting. In the result, it has been clarified to what influence the sensitiveth of detection receives by adhesive thickness, adherent thickness, defection scale and adhesive hardnee etc.