摘要
综述了接插件连续镀金、钯、锡的电镀工艺，包括设备、镀液和镀层性质。
Summarizes continuous plating processes for electronic connector assemblies including gold, palladium and, tin plating solutions, properties of the films, and continuous plating equipment.
出处
《电镀与涂饰》
CAS
CSCD
1994年第4期42-45,共4页
Electroplating & Finishing
关键词
接插件
电镀
表面处理
电子电路
connector assembly, gold plating, palladium plating, tin plating
