2M1L-HDBK-217F--1991, Reliability prediction of electronic equipment [ S].
3MIL STD 883F--2004, Test method standard microcircuits, thermal characteristics IS].
4CAO X, WANG T, KHAI D T N. Characterization of" lead-free solder and sintered nano-silver die-attach layers using thermal impedance [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1 (4): 495-501.
5SCHERZP.发明者电子没计宝典[M].蔡声镇,译.福州:福建科学技术出版社,2004:7.
6Souda M, Endo F, Yamazaki C, et al. Development of high power capacitor charging power supply for pulsed power applications[C]// 12th IEEE International IEEE Pulsed Power Conference. Monterey, USA: IEEE, 1999: 1414-1416.
7Wang C, Kang Y, Lu B, et al. A high power-density, high efficiency front-end converter for capacitor charging applications[C]//20th An- nual IEEE Applied Power Electronics Conference and Exposition. IS. 1.]: IEEE, 2005: 1258-1264.
9Sheng H G, Shen W, Wang H F, et al. Design and implementation of a high power density three-level parallel resonant converter for capacitor charging pulsed-power supply[J]. IEEE Transactions on Plasma Sci- ence, 2011, 39(4): 1131-1140.
