真空微电子器件中的场致发射阴极硅锥尖的制备工艺研究

The Investigation of the Fabrication Tehnology of Field Emission Si -Tip Cathode for Vacuums Microeletronic Devices

本文介绍了真空微电子器件中的场发射阴极硅锥尖的制作工艺，采用不同的腐蚀方法以及氧化削尖技术，制成了形状较好的硅尖，并对实验研究结果进行了比较、分析和讨论。

The fabrication technology of field emission si-tip cathodes for vacuum microeletronic devices is described in this paper.Well shaped si-tip array cathods were,obtained by using different etching methods and oxidation sharpening techniques and the photomicrographs are given,The detailed analysis and dixcussion are made on the process techinology.