摘要
介绍了片式铝电解电容器较其他片式元件发展迟缓的原因:关键是技术难度大。表面贴装技术是第四代电子组装技术,片式铝电解电容器是这一技术中不可缺少的元件。它能否实现国产化,使之成为商品,已成为人们关注的热点。本文从工艺、性能、技术角度,讨论了片式铝电解电容器在研制过程中的技术难点和采取的技术措施。
This paper analysises causes for slower development of chip aluminium electrolytic capacitors than the other chip components:the key is more difficult in technique.In SMT used as the fourth generation of electronic mounting technology chip aluminium electrolytic capacitors are indispensable components. Their domestization and commercialization become the attentive focus. From the angles of technology. characteristics and technique the technical difficulties in development of chip aluminium electrolytic capacitors and adopted measures are discussed.
出处
《电子元件与材料》
CAS
CSCD
1994年第5期19-22,共4页
Electronic Components And Materials
关键词
片式
铝电解电容器
国产化
chip component. aluminium electrolytic capacitor . domestization