片式陶瓷电容器技术的新进展

New Progress in Chip Ceramic Capacitors Technique

电子设备表面安装技术（ＳＭＴ）和小型化的进展，促使电子元件包括陶瓷电容器的片式化率不断提高，尺寸不断缩小。提高瓷料的介电常数，减小介质层的厚度，保持电极可靠的接触及降低瓷料的焙烧温度是当前的主要研究课题。同时为了提高电容器的性能．要求改进瓷料的热稳定性；为了降低电容器的成本，需要采用贱金属电极。本文从这几方面叙述了目前世界上的进展情况，并指出了其发展趋势。

Progress in surface-mounting technique(SMT) and miniaturization of electronic equipment promotes enhancement of surface mountable component ratio in sum of ceramic capacitors and their sizes shrinkage.Facing main topics are enhancement of dielectric constant of ceramics, decrease of it's firing temperature.decrease of dielectric layer thickness and keeping reliable contact of electrodes. Improvement of capacitor performance requires ceramics materials to elevate their thermostability and reduction of production cost requires use of base metal electrodes. Recent progress and trends in these aspects at the world are described in this paper.