摘要
片式ＭＬＣ上涂烧Ｔ９４１０银浆。由瓦特型镀镍法得到镍阻挡层。通过加入稳定剂使氯化亚锡、酒石酸──碱式碳酸铅、乙二胺四乙酸钠──柠檬酸体系稳定，再加入醇类和胺类表面活性刘，在ｐＨ值５．０～６．０、温度２７～３５℃、电流密度０．３～０．７Ａ／ｄｍ２条件下得到致密、均匀而白亮的镀层。在１２０６型片式ＭＬＣ上经６５ｍｉｎ电镀，得到厚度约８μｍ的锡铅镀层，具有与锡铅焊料类似的金相结构，可焊性优良，在１０Ｎ的拉力下５ｓ不脱落。
T9410 paste is coated and sintered in chip multilayer ceramic capacitors (MLC)as internal electrodes. Nickel barrier on their terminations is plated by Watt plating. Applied electrolytes-stannous chloride. tartaric acid-lead subcarbonate and ethylenediamine sodium tetraacetate-ritric acid systems are stabilized by addition of stabilizers. A dense, homogeneous and bright plating is obtained by addition of alcohol and amine surface activators under pH- 5. 0-6. 0, temperature 27-35℃ and current density 0. 3-0. 7 A/dm2. In type 1206 MLC atin-lead plating with about thickness 8μm and metallographic structure similar to tin-lead. solder is obtained for 65 minutes. This plating has good weldability and can withstand 10 N pulling force during 5s without sealing-off.
出处
《电子元件与材料》
CAS
CSCD
1994年第6期35-38,共4页
Electronic Components And Materials
关键词
片式多层陶瓷电容器
端电极
Sn-Pb合金
电镀
Chip multilayer ceramic capacitor
termination electrode
Sn /Pb alloy
plating
