摘要
用电子增强热灯丝ＣＶＤ（化学汽相沉积）方法制备出膜厚为０．１－２ｍｍ的金刚石厚膜，研究了金刚石厚膜的耐磨性和热导特性，用它制作了金刚石膜焊接刀具和半导体激光器用金刚石膜热沉。
A diamond thick film(0.1-2mm thick )has been grown by electron assistant hot filament CVDmethod. The wear resistivity and thermal conductivity of the diamond thick film are investigated,anddiamond film brazed cutting tools and heat sinks of diamond film have been made using the diamond thickfilm.
出处
《高技术通讯》
CAS
CSCD
1994年第8期1-4,共4页
Chinese High Technology Letters
基金
863计划资助项目
关键词
CVD
金刚石薄膜
半导体薄膜
制备
Electron assistant hot filament CVD, Diamond thick film , Diamond film brazed tcol,Heat sink of diamond film
