深度同步辐射光刻初探

Primary Study of Deep-Etch Synchrotron Radiation Lithography

ＬＩＧＡ技术被认为是制作微机械最有前途的方法，而ＬＩＧＡ技术较为关键的一步是深度同步辐射光刻．报道了深度同步辐射光刻的进展，刻蚀出了外圆直径为３８μｍ～３９μｍ，叶长约８μｍ，高约２５μｍ的扇叶状微结构元件．ｉｎＧｅｒｍａｎ：Ｌｉｔｈｏｇｒａｆｉｅ，Ｇａｌｖａｎｏｆｏｒｍｕｎｇ，ＡｂｆｏｒｍｕｎｇＦｉｇ．ＩＳＥＭｏｆＰＭＭＡｆａｎｅｔｃｈｅｄｂｙｄｅｅｐ＂ｅｔｃｈｓ－ｃ。

The LIGA technology is based on a combination of deep-etch synchrotronradiation lithography. electroforming and molding process. The key and base step issynechrotron radiation lithography. Our primary study of deep-etch synchrotron radiationlithography is reported in this paper. The results is indicated that the microstructure likefan was lithographled by using synchrotron radiation, diameter is about 38～39 μm, thelength of foliag is 8 μm and windth 2. 8 μm, the height is about 25 μm.