铜钯金属纤维复合材料的界面研究

A Study on Interface in Cu/Pd Fibre Composite Materials

利用金相显微镜和扫描电子显微镜研究Ｃｕ／Ｐｄ纤维复合材料的界面结构及界面固溶区生长动力学；确定导电率与热处理条件之间的关系；给出最佳热处理条件范围。揭示Ｃｕ与Ｐｄ这两种由典型的固溶型元素组成的金属纤维复合的非平衡材料的基本特征。

The microstructure and kinetics of growth for solid solution layer between Cu matrix and Pd fibre in Cu/Pd composite materials have been examined using the metallographic microscope and scanning electron microscope. Some mechanic and electronic properties of Cu/Pd materials at 350～500 ℃/0.25～4h were measured.The relation between electric conduct-ivity and condition of heat treatment and optimum bounds of thermal trea-tment condition have been particularly determined.The paper brought to light essential characteristic of Cu/Pd fibre comp-osite materials as a typical imbalance materials.