电路板测试技术进展

The Progress of Printed Circuit Board Testing Technique

航空电子产品的测试以往经常采用生产线上的电路内测试(ICT)和对成品在自动测试设备(ATE)上的功能测试。80年代早期功能测试工具尚不普遍,其功能测试软件还很有限。功能测试的设计和编程是很费时的,往往产品已先出厂使用,而测试程序尚未完成。今天自动测试设备已较成熟,开发的功能测试程序已较多。印刷电路板(PCB)的测试利用钉床(bed of nail)夹具及各种相应的适配转换接口件实现电路内测试。然而由于电路板上密集度不断提高,ICT法已几乎难于实现。

Recently, high-density PCB lacking of internal nodal access needed for in-cir-cuit testing, manufacturers are more devoted to the reduced-contact test strategy, including boundary scan testing, fault simulator, fault dictionary technique. The design-for-testibility and computer-aided-testing have been widely heralded as the much needed solutions to a variety of testing problems .