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1.56MeV Sb^+注入单晶硅的反常退火行为

Unusual annealing behavior of 1.56 MeV Sb ̄+ ion implanted single-crystal silicon
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摘要 剂量为2×10(13)-5×10(15)cm(-2)的1.56MeVSb+注入Si(100)后,向石英炉中通入流动纯Ar气进行热退火(退火温度为500一1050℃,时间为30min)。采用3MeVHe(2+)卢瑟福背散射/沟道技术和透射电镜技术测量样品的注人损伤以及退火特性,结合计算机模拟数据,结果表明:缺陷的产生类型与注入离子的剂量、样品退火温度密切相关。 The damage and annealing behavior of 1.56 MeV Sb+ ion implanted Si(100) have been studied. The dose range of implantation was 2 × 1013-5 × 1015 Sb+/cm2. The samples were annealed for 30 minutes in flowing Ar gas at temperatures ranging from 500 to 1050 ℃ in a conventional furnace tube. The implantation-induced damage and annealing quality of the samples were measured with 3 MeV He+ RBS/channeling and TEM techniques. In addition, a computer simulation of ion implantation damage has been performed with TRIM program. It is concluded that the category of defects is related to ion dose and annealing temperature of samples.
出处 《核技术》 CAS CSCD 北大核心 1994年第1期1-6,共6页 Nuclear Techniques
基金 中国科学院上海冶金研究所离子束开放实验室资助
关键词 退火 缺陷 再结晶 离子注入 单晶硅 Implantation, Annealing, Defects, Recrystalization
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