高速高密度多芯片模块的热设计

Thermal Design for High Speed High Density Multichip Module

由多个芯片直接安装在电路基片上的多芯片模块（ＭＣＭ）可望缩短布线长度，提高运算速度和组装密度，从而应用于宽带综合服务数字网络（Ｂ—ＩＳＤＮ）中。然而，随着半导体器件储存成度和组装密度的提高和模块外形尺寸的缩小，功耗密度随之增加。这使得热设计显得更加重要。本文介始了在高速高密度多芯片模块的热设计中应用有限元分析法模型的边界条件。着重研究了热路、散热片以及提高热传递模拟精度的方示。

The use of modules consisting of multiple semiconductor chipsmounted directly on circuit boards(multichip modules)holds promise for shorter circuitline lengths,with higher operating speeds and higher detisity in broadband integratedservices digital network(B ISDN)applications. However,as more highly integratedsemiconductors and denser module configurations are developed,power consumption insuch modules increases,making thermal design increasingly important.The boundary conditions of models for finite element analysis of the thermal designof high speed high density multichip modules are examined, principally the thermalvia and heat sink,and means of improving the accuracy of heat transfer analysis simula-tion are investigated.