低温沉积法金刚石－金属化学键合工艺研究

STUDIES ON THE TECHIQUE OF CHEMICAL BONDING BETWEEN DIAMOND AND ITS METAL LAYERS DEPOSITED AT LOW TEMPERATURES

采用低温沉积工艺在金刚石表面镀复钨合金，通过键合处理，钨可和金刚石表面碳原子形成稳定的碳化钨层。键合层的存在有利于保护金刚石的强度性能，大幅度提高了金刚石与胎体的粘结强度、锯片与钻头的使用性能。金相检测证实了金刚石表面键合层的存在，并反映出键合层有质地均匀、分布连续、涂复率高的特点。

Tunsten alloy layers were deposited on diamond surfaces at low temperatures,and then underwent a heat treatment in vaccum or in a reducing atmosphere at more than800℃ to form a stable WC layer due to their reaction with carbon atoms on the surfaces,thus keeping the strength performance of diamond from degradation,and greatly improvingits adhesive strength to the saw blades or drill bits,and their operational performances.Metallographic examination confirmed that continuous,uniform, chemical bonded WC layershave formed on diamond surfaces with a high reproducibility.