摘要
对铸坯产生皮下气泡的原因进行了调查和分析。认为中间包绝热板村中的有机挥发物和残余水分是铸坯产生皮下气泡的主要原因。从中间包绝热板的配方、制造技术和装砌等方面采取改进措施,可有效减少铸坯皮下气泡。
The season of skin hole has been analyzed.It is reckoned that the organic volatimatter and residual water in the insulating board are the main reason arousing the skin hole.Some improvement in insulating board composition,in shaping process and lining technology can effectively reduce the skin hole.
出处
《耐火材料》
CAS
北大核心
1994年第5期271-272,268,共3页
Refractories