摘要
本文针对橡胶填充环氧树脂体系和玻璃珠填充环氧树脂体系,研究了界面残余应力的退火效应和温度变化行为。样品的残余应力与退火时间有关。温度与界面残余应力成线性反比关系。在两体系中,界面残余应力随温度升高而下降的速度不相同。
The study was made on the effect of annealing and annealing temperature on the interfa-cial residual stress in rubber-filled and glass bead-filled epoxy resin systems.The residual stress in the specimens was related to the annealing time,and the there was a linear proportion by inversion between the annealing temperature and the interfacial residual stress. The rate of fall-off of the interfacial residual stress with the rise of the annealing temperature is different in the two systems.
出处
《热固性树脂》
CAS
CSCD
1994年第1期5-8,共4页
Thermosetting Resin
