硅片的几何参数及其测试

Geometric Parameters of Silicon Wafer and Its Test and Measurement

本文介绍了硅片的加工质量：直径、厚度、平整度、弯曲度、翘曲度等的含意、测量和计算方法，以及其中一些参数之间的关系。最后对硅片激光标记及规范作了概述。

The meaning, measurement and calculating method of the processing qualities of silicon wafers such as diameter, thickness, flexibility and deflection, as well as the relations between some of them are introduced in this articale. The laser symbol of silicon wafer and its standard are outlined briefly also.