摘要
本文介绍了板上芯片技术．讨论了封装对板上芯片技术的影响，给出了封装的实验结果．
The technique of the ehip on boord is Introduced. The facfors for bonding andpackaging to influce the technique of the chip on board are discussed. The test result ofpackaging is given.
出处
《天津理工学院学报》
1994年第3期35-37,共3页
Journal of Tianjin Institute of Technology
关键词
板上芯片
键合
封装
chip on board bonding packaging.
