摘要
研究了机械合金化工艺制备纳米晶W-25Cu复合粉末的烧结致密化和晶粒长大行为,并考察了一种新型晶粒长大抑制剂对抑制W晶粒长大的作用,探讨了其作用机理。结果表明,烧结致密化和晶粒长大强烈依赖于烧结温度和时间。经1200℃烧结30min后,烧结相对密度和W晶粒尺寸为97.7%和310nm。新型晶粒长大抑制剂抑制W晶粒长大效果明显。
Sintering densification and grain growth behavior of nanograined W-25Cu composite powder produced by mechanical alloying are studied, the effect of a new grain growth inhibitor on W grain growth as well as its affecting mechanism is investigated. The results show that densification and grain growth during sintering are strongly reliable on sintering temperature and time. The relative density of 97.7% and the average grain size of 310nm or so can be achieved after sintering at 1 200℃ for 30min. The new grain growth inhibitor in this experiment is proved to be effective.
出处
《中国钨业》
CAS
北大核心
2005年第1期39-43,共5页
China Tungsten Industry
