硫代硫酸盐无氰脉冲镀银工艺研究

Study on the Thiosulfate Cyanide-free Silver Pulse Plating Process

对无氰镀银工艺进行了优选,找到一种无氰光亮镀银添加剂的配方,并对其工艺参数进行优选,得出最佳脉冲参数为:脉宽1ms,占空比为10%,电流密度为0.6A/dm2。在最佳工艺参数下得到的银镀层镜面光亮,与直流镀银相比,抗变色性和耐蚀性均显著提高,并通过扫描电镜观察了镀层的表面形貌。

Cyanide-free silver plating processes were optimized. A mirror-like bright additive for the cyanide-free bright silver plating process was found out. The optimum pulse parameters of pulse electrodeposition of bright silver were optimized, and 1 millisecond pulse width, 10% positive duty cycle and 0.6 A/dm^2 average cathodic current densities were obtained. The anti-tarish property and the corrosion resistance of silver coating with pulse plating were higher than those with DC plating. The appearnace morphology of the silver coatings were analyzed by SEM.