摘要
本文介绍了在表面安装过程中出现的一些缺陷,这些缺陷会影响产品的可靠性,使电路性能变差。作者针对这些缺陷,提出了相应的解决方案。
In the process of surface mount technology,certain defects would occure,which affect reliability of the products and degrade circuit performance. In this paper,solutions are proposed to deal with these defects.
出处
《微电子学》
CAS
CSCD
1994年第6期35-37,共3页
Microelectronics
关键词
表面安装技术
缺陷
电子封装
SMT
Surface mount technology,Defect,Electronic packaging