期刊文献+

标准CMOS工艺集成肖特基二极管设计与实现(英文) 被引量:1

Design and Fabrication of Schottky Diode with Standard CMOS Process
下载PDF
导出
摘要 提出了一种在标准CMOS工艺上集成肖特基二极管的方法 ,并通过MPW在charted 0 35 μm工艺中实现 .为了减小串连电阻 ,肖特基的版图采用了交织方法 .对所设计的肖特基二极管进行了实测得到I V ,C V和S参数 ,并计算得出所测试肖特基二极管的饱和电流、势垒电压及反向击穿电压 .最后给出了可用于SPICE仿真的模型 . Design and fabrication of Schottky barrier diodes (SBD) with a commercial standard 0 35μm CMOS process are described.In order to reduce the series resistor of Schottky contact,interdigitating the fingers of schottky diode layout is adopted.The I-V,C-V ,and S parameter are measured.The parameters of realized SBD such as the saturation current,breakdown voltage,and the Schottky barrier height are given.The SPICE simulation model of the realized SBDs is given.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2005年第2期238-242,共5页 半导体学报(英文版)
基金 国家高技术研究发展计划资助项目 (批准号 :2 0 0 3AA1Z12 80)~~
关键词 CMOS 肖特基二极管 集成 CMOS Schottky diode integration
  • 相关文献

参考文献9

  • 1Sharma B L.Metal-semiconductor Schottky barrier junctionsand their applications.New York:Plenum,1984
  • 2Hudait M K,Vankateswarlu P,Krupanidhi S B.Electrical transport characteristics of Au/n-GaAs Schottky diodes on n-Ge at low temperatures.Solid-State Electron,2001,45(1):133
  • 3Zhang Yuming,Zhang Yimen,Alexandrov P,et al.Fabrication of 4H-SiC merged PN-Schottky diodes.Chinese Journal of Semiconductors,2001,22(3):265
  • 4张海燕,叶志镇,黄靖云,李蓓,谢靓红,赵炳辉.在薄硅外延片上制备高频肖特基势垒二极管[J].Journal of Semiconductors,2003,24(6):622-625. 被引量:5
  • 5Milanovic V,Gaitan M,Marshall J C,et al.CMOS foundry implementation of Schottky diodes for RF detection.IEEE Trans Electron Devices,1996,43(2):2210
  • 6Rivera B,Baker R J,Melngailis J.Design and layout of Schottky diodes in a standard CMOS process.International Semiconductor Device Research Symposium,2001:79
  • 7Rhoderick E H.Metal-semiconductor contacts.Second edi-tion.Oxford:Oxford University Press,1988
  • 8Cha S I,Cho Y H.Novel Schottky diode with selfalignedguard ring.Electron Lett,1992:1221
  • 9Aktas A,Ismail M.Pad de-embedding in RF CMOS.IEEECircuit and Devices Magazine,2001,17(3):8

二级参考文献9

  • 1叶志镇.超高真空CVD极低温低压硅外延与高分辨TEM分析研究[J].Journal of Semiconductors,1994,15(12):832-837. 被引量:4
  • 2Hudait M K,Vankateswarlu P,Krupanidhi S B.Electricaltransport characteristics of Au/n-GaAs Schottky diodes on n-Ge at low temperatures.Solid-State Electron,2001,45:133
  • 3Crowe T W,Hesler J L,Weikle R M.GaAs devices and circuits for terahertz applications.Infrared Physics & Technology,1999,40:175
  • 4Zhang Yuming,Zhang Yimen,Alexandrov P,et al.Fabrica-tion of 4H-SiC merged PN Schottky diodes.Chinese Journal of Semiconductors,2001,22(3):265
  • 5Meyerson B S,Uram K J,LeGoues F K.Appl Phys Lett,1988,53(25):2555
  • 6SSM350 spreading resistance instruction manual.Solid State Measurements Inc,1999:3
  • 7Rhoderick E H.Metal-semiconductor contacts.Second Edition.Oxford University Press,1988
  • 8叶志镇,曹青,张侃,陈伟华,汪雷,李先杭,赵炳辉,李剑光,卢焕明.UHV/CVD低温生长硅外延层的性能研究[J].Journal of Semiconductors,1998,19(8):565-568. 被引量:6
  • 9王姝睿,刘忠立,徐萍,葛永才,姚文卿,高翠华.6H-SiC高压肖特基势垒二极管[J].Journal of Semiconductors,2001,22(8):1052-1056. 被引量:1

共引文献4

同被引文献1

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部