摘要
提出了一种在标准CMOS工艺上集成肖特基二极管的方法 ,并通过MPW在charted 0 35 μm工艺中实现 .为了减小串连电阻 ,肖特基的版图采用了交织方法 .对所设计的肖特基二极管进行了实测得到I V ,C V和S参数 ,并计算得出所测试肖特基二极管的饱和电流、势垒电压及反向击穿电压 .最后给出了可用于SPICE仿真的模型 .
Design and fabrication of Schottky barrier diodes (SBD) with a commercial standard 0 35μm CMOS process are described.In order to reduce the series resistor of Schottky contact,interdigitating the fingers of schottky diode layout is adopted.The I-V,C-V ,and S parameter are measured.The parameters of realized SBD such as the saturation current,breakdown voltage,and the Schottky barrier height are given.The SPICE simulation model of the realized SBDs is given.
基金
国家高技术研究发展计划资助项目 (批准号 :2 0 0 3AA1Z12 80)~~