Fabrication of 1.55μm Si-Based Resonant Cavity Enhanced Photodetectors

硅基1.55μm共振腔增强型探测器(英文)

A novel bonding method using silicate gel as bonding medium is developed.High reflective SiO 2/Si mirrors deposited on silicon substrates by e-beam deposition are bonded to the active layers at a low temperature of 350℃ without any special treatment on bonding surfaces.The reflectivities of the mirrors can be as high as 99 9%.A Si-based narrow band response InGaAs photodetector is successfully fabricated,with a quantum efficiency of 22 6% at the peak wavelength of 1 54μm,and a full width at half maximum of about 27nm.This method has a great potential for industry processes.

报道了一种利用硅乳胶作为键合介质的新型键合技术 .高反射率的SiO2 /Si反射镜预先用PECVD系统生长在硅片上 ,然后键合到InGaAs有源区上 ,键合温度为 35 0℃ ,无需特殊表面处理 ,反射镜的反射率可以高达 99 9%以上 ,制作工艺简单 ,价格便宜 .并获得硅基峰值响应波长为 1 5 4 μm ,量子效率达 2 2 6 %的窄带响应 ,峰值半高宽为 2 7nm .本方法有望用于工业生产 .