摘要
介绍了一种基于ISO/IEC14443协议的带有片上天线的近耦合非接触式IC卡的芯片设计,它将天线集成到芯片中并用状态机代替MCU作为芯片的控制器,采用0.35μm工艺模型,用HSPICE对天线、模拟电路进行了仿真,采用Verilog语言和Synopsys综合工具对数字电路进行了VLSI设计.芯片仿真结果表明功能及各项性能达到了原定指标.
A design for the Contactless Smart Card Chip,compatible with the ISO/IEC 14443 Standard,is presented.The antenna is integrated into the chip and state-machines are used as the chip controller instead of MCU. On-chip antenna and analog circuits with 0.35 μm CMOS technology model are simulated by HSPICE,meanwhile the digital system is designed with Verilog language and Synopsys tools.The simulation results show that functions and performance of the chip design are satisfactory.
出处
《复旦学报(自然科学版)》
CAS
CSCD
北大核心
2005年第1期65-69,共5页
Journal of Fudan University:Natural Science