消除产品良率隐藏的杀手——电子束检查是铜逻辑和晶圆代工厂的最佳方法

Eliminating Buried Yield Killerse-Beam Inspection: Best Practices for Copper Logic and Foundry Fabs

监控和消除隐藏的电路缺陷已成为130nm和130nm以下器件的关键。这使得电子束检查正在广泛应用于开发、试生产和量产的监控过程。我们将描述当前铜逻辑和晶圆代工厂电子束检查技术的执行情况,其中包括详细的案例研究,它说明了从开发到量产过程中应用电子束检查技术的好处。我们也描述了过去克服通用工具障碍的方法。然后,分别介绍了利用电子束检查技术的新进展,以及为假设的20000WSPMφ300mm工厂模拟的最理想执行情况的最佳实例。

Monitoring and eliminating buried electrical defects has become critical for 130 nm copper devices and below. As a result, electron-beam inspection is being widely adopted for development, ramp, and volume production monitoring. In this paper we describe current implementation of e-beam inspection technology for copper logic and foundry fabs, including specific case studies which illustrate the benefits of applying e-beam inspection technology from development through volume production. We also describe methods used to overcome common implementation hurdles. We then pair best practices with new advances in e-beam inspection technology to model the optimal implementation for a hypothetical 20 000 WSPM 300 mm fab.