利用荧光技术对二氧化硅胶体旋转流动特性的研究

Research of SiO_2-hydrosol Flows Properties in Centrifugal Spin with Fluorescence Technique

应用开发的荧光测试实验台研究了纳米二氧化硅(SiO2)胶体旋转时液体的厚度变化,并计算了液体的压力分布.结果表明,流体平均厚度为0.3～0.9 mm时,二氧化硅(SiO2)胶体在旋转时厚度会发生变化,中间处厚度减小,边缘处厚度增大,随着速度增大这种趋势更显著.二氧化硅(SiO2)胶体旋转时中间压力最大,随着速度增大,压力略微增大,但幅度很小.

To experimentally study the mechanism of chemical mechanical polishing (CMP), the SiO2-hydrosol flows properties in centrifugal spin were explored with the help of fluorescence technique. Result shows that, when the distance of the polishing pad and the glass disk lies in the range of 0.3-0.9 mm, the thickness of SiO2-hydrosol in the center of the polishing pad falls during rotating, and the trend is greatly manifested with the rate increasing, while the thickness in the fringe increase slightly. Then typical pressure distribution was numerically simulated. The pressure varies with the position in the radial direction. The maximum pressure occurs in the center, but with the speed increasing, pressure rises slightly.