摘要
空洞是球栅阵列(BGA:BallGridArray)器件在装配过程中形成的主要缺陷之一,本文以增强性BGA(EBGA:EnhancedBGA)为研究对象,采用统一型粘塑性Anand本构方程描述Sn63Pb37的粘塑性力学行为,应用非线性有限元的方法分析了不同位置和大小的空洞对焊点疲劳寿命的影响,为制定装配后的BGA焊点接收标准提供理论参考。
Voids in EGA (ball grid array) solder joints have been considered as a main defect in assembly. By taken the EBGA (enhanced-BGA) solder joints as an example, the unified viscoplastic Anand constitutive equation has been employed to represent the viscoplastic deformation behavior and nonlinear finite element method has been applied to study the effect of size and location of voids on the fatigue life of solder joints, therefore the theoretical reference to establishing the inspection criteria of voids in BGA solder joints has been supplied.
出处
《计算力学学报》
EI
CAS
CSCD
北大核心
2005年第1期119-123,共5页
Chinese Journal of Computational Mechanics
关键词
焊点
空洞
热疲劳寿命
非线性有限元分析
粘塑性
Deformation
Fatigue of materials
Finite element method
Inspection
Life cycle
Nonlinear systems
Reliability
Thermal effects
Viscoplasticity
