摘要
应用声发射检测技术研究金属铝单搭接胶接结构的缺陷检测和强度估计问题。研究结果表明,声发射检测技术和超声检测枝术相比,其胶接缺陷识别准确率较高,胶接强度估计精度相差甚微。研究结果为在低应力条件下应用声发射技术检测胶接结构缺陷和预测胶接结构强度提供依据。
The defect testing and strength estimating of metal to metal single step-lap adhesive bond structures are studied by means of acoustic emission (AE) technique. Results show that the method is effective for AE signal processing and can supply the basis for defect testing and strength predicting of adhesive bonds under lower stress conditions.
出处
《无损检测》
北大核心
1994年第6期154-156,163,共4页
Nondestructive Testing
