酸性化学镀Ni-Cu-P工艺及性能研究

Study on the technique and properties of acidic electroless Ni-Cu-P plating

研究了酸性化学镀Ni Cu P镀液的pH值对镀层性能和镀速的影响。采用酸性镀液体系,通过正交实验,确定了化学镀Ni Cu P的工艺配方为:0 3g/LCuSO4·5H2O,25g/LNiSO4·6H2O,30g/L柠檬酸钠,20g/L络合剂,40g/L缓冲剂,25g/LNaH2PO2·H2O,0 16g/L稳定剂,θ80～85℃,pH值5～6,t为2h。通过X射线衍射实验研究了镀层的晶型结构,并对化学镀Ni Cu P镀层与Ni P镀层的极化行为进行了研究。结果表明:所得的化学镀Ni Cu P镀层为非晶态结构;其外观光亮,耐硝酸腐蚀时间大于800s,孔隙率为9级,镀速为8μm/h;Ni Cu P合金镀层比Ni P镀层具有更优异的耐蚀性能。

Influence of pH value of acidic electroless Ni-Cu-P plating bath on deposit′s properties and plating speed were studied. The optimal process formula was identified by orthogonal experiment as follows: 0.3 g/L of CuSO_4·5 H_2O, 25 g/L of NiSO_4·6H_2O, 30 g/L of sodium citrate, 20 g/L of complexant, 40 g/L of buffering agent, 25 g/L of (NaH_2PO_2·H_2O,) 0.16 g/L of stabilizer, temperature of 80～85 ℃, pH value of 5～6 and plating time of 2 h. The structure of deposits was determined by XRD. The polarization behavior of electroless Ni-Cu-P and Ni-P deposits were investigated. The results show that the electroless Ni-Cu-P deposits have amorphous structure with bright appearance,time of nitric acid corrosion resistance of more than 800 s, 9 grade of porosity, 8 μm/h of plating speed. The deposits of Ni-Cu-P have better corrosion resistance than Ni-P deposits.