摘要
分立器件封装也是微电子生产技术的基础和先导。本文介绍国内外半导体分立器件封装技术及产品的主要发展状况,评述了其商贸市场的发展趋势。
Discrete device packaging is one of the basis and the pioneer of microelectronic technology. An overall review of the main development of technology and productions for semiconductor discrete device packaging is made in this paper. The business and market developing trend for these devices are described too.
出处
《电子与封装》
2005年第2期12-17,共6页
Electronics & Packaging
关键词
半导体
封装
分立器件
Semiconductor Packaging Discrete Device
