摘要
研究了用于铝合金钎焊的新型Al-Si-Cu-Ge系钎料,通过快冷工艺制备了厚度90μm^150μm的钎料薄带。对所研究钎料的熔化温度区间及金相组织进行了分析和判定,结果表明:与Al-9. 6Si-20Cu钎料相比,钎料熔化温度大幅降低;普通钎料和快冷钎料的固相线相差30℃左右,液相线差别约5℃;普通钎料的微观组织主要由Al-Si-Cu-Ge、Al-Si-Ge和Al-Cu共晶相、Si-Ge先析出相及θ(Al2Cu)相组成;快冷钎料晶粒尺寸范围约1μm^5μm。
A moderate filler metal Al-Si-Cu-Ge series alloys was developed for brazing low-over-burned Al alloys,for example LY12 Al alloy,the molten temperatures of the above alloys were measured.It was found that, comparing with Al-9.6Si-20Cu,the melting temperature of the above alloys descend about 40 ℃,the difference of the solidus temperatures between ordinary filler metal and rapid solidification filler metal about 30 ℃,the liquidus temperature about 5 ℃.The metallographic analysis shows that, microstructures of the ordinary filler metal include Al-Si-Cu-Ge,Al-Si-Ge and Al-Cu eutectic phases, Si-Ge precipitated phase and θ(Al_2Cu)phase,grain size of the rapid solidification filler metal is about 1 μm~5 μm.
出处
《电子工艺技术》
2005年第2期68-70,74,共4页
Electronics Process Technology
基金
北京市自然科学基金项目(项目编号: 2052006)
国家自然科学基金项目(批准号: 50475043)。
关键词
Ge
铝基钎料
铝合金
Ge
Al based filler metal
Al alloy