摘要
低温共烧多层陶瓷(LTCC)基板,具有高密度布线,内埋无源元件,IC封装基板和优良的高频特性,目前在宇航、军事、汽车、微波与射频通信领域得到广泛运用,是MCM技术的关键部件。本文介绍了LTCC基板制造的关键技术和性能控制。
LTCC substrate is of high density of layout,embed passive element,IC packaging subsctrate and good property of high frequently.Now LTCC is widely used in astronavigation,military,automobile,microwave and RF communication.LTCC is the key element of MCM technology.Introduce the key manufacture technology and control of LTCC substrate.
出处
《电子工艺技术》
2005年第2期75-81,共7页
Electronics Process Technology
