摘要
The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1 .7eV.
The corrosion behavior of copper in 3% NaCl solutions has been investigated using AES. XPS and photoelectrochemical tectniques. The results show that Cl- has remarkable influence on the corrosion behavior of copper. With the increasing immersion time, the photoresponse of copper electrode changes from p-type to n-type gradually, and the invasion degree of Cl- ions on copper electrode increases. Finally, the band gap of the sedriconduct film formed on copper electrode surface is 1 .7eV.
出处
《物理化学学报》
SCIE
CAS
CSCD
北大核心
1994年第5期452-455,共4页
Acta Physico-Chimica Sinica
基金
国家自然科学基金
关键词
铜
光电流
氯化钠
腐蚀
光电化学
Cu, Photocurrent (I_(ph)), Open circult photovoltage (V_(oph)), Cl
