微量添加元素Bi、In、Ag在Sn－Pb钎料中的表面活性作用

SURFACE-ACTIVE ACTION OF MICROADDING ELEMENTS Bi,In AND Ag IN TIN-LEAD ALLOY SOLDER

采用一种新的液态合金表面张力测试方法测定了二元液态Ｓｎ－Ｐｂ钎料表面张力值随Ｓｎ含量及温度的变化关系，研究了添加微量Ｂｉ、Ｉｎ、Ａｇ元素在低Ｓｎ含量Ｓｎ－Ｐｂ钎料中的表面活性作用，指出Ｂｉ和Ｉｎ能显著地降低钎料合金系的表面张力，具有较强表面活性作用，而Ａｇ对钎料合金系表面张力值的降低作用较小，表面活性作用较弱。

A new method for measuring the surface tension of liquid alloy has been developed to determine the relationship of the surface tension vs.the tin content and temperature in tin-lead binary alloy. The surface-active action of microadding elements Bi,In and Ag in low tin content liquid tin-lead alloy has also been studied.The experimental results indicate that the microadding elements Bi and In have strong surface-active action,and can decrease the surface tension of tin-lead based alloy evidently,while that of Ag is a bit weak relatively.