摘要
A kind of salt-based colloid palladium of high concentration was prepared, with concentration up to 3.6 g/L on amount of PdCl2. The optimal preparation conditions of the salt-based colloid palladium were that the PdCl2 and NaCl concentrations were respectively 3.6 g/L and 175 g/L, mole ratio of Sn to Pd was 50∶1, reaction temperature was 2035 ℃, with urea, ascorbic acid and vanillin added in a proper amount. The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s, the time of completely coating copper on a test substrate is 2 min, the stability time of colloid palladium is 98 h after it is diluted into 0.1 g/L(on amount of PdCl2) when the solution temperature is 20 ℃, the backlight lever of electroless copper plating layer is 10th grade of 10-grade system, the adhesion force of the copper layer is up to GB5270—85 of China, and the average particle size of the colloid palladium is 81 nm measured by Master Sizer.
A kind of salt-based colloid palladium of high concentration was prepared, with concentration up to 3.6 g/L on amount of PdCl_2. The optimal preparation conditions of the salt-based colloid palladium were that the PdCl_2 and NaCl concentrations were respectively 3.6 g/L and 175 g/L, mole ratio of Sn to Pd was 50∶1, reaction temperature was 2035 ℃, with urea, ascorbic acid and vanillin added in a proper amount. The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s, the time of completely coating copper on a test substrate is 2 min, the stability time of colloid palladium is 98 h after it is diluted into 0.1 g/L(on amount of PdCl_2) when the solution temperature is 20 ℃, the backlight lever of electroless copper plating layer is 10th grade of 10-grade system, the adhesion force of the copper layer is up to GB5270—85 of China, and the average particle size of the colloid palladium is 81 nm measured by Master Sizer.
出处
《中国有色金属学会会刊:英文版》
CSCD
2005年第1期190-194,共5页
Transactions of Nonferrous Metals Society of China
基金
Project supported by Hubei Daye Nonferrous Metal Corporation of China
关键词
盐基钯胶子
稳定性
化学镀层
浓度活性
salt-based colloid palladium
preparation
activation
stability