化学镀镍配方的优化及镀镍过程机理的研究

The Optimization of the Chemical Plating Nickel Formula and Study on Mechanism of the Plating Process

采用正交设计法,就化学镀镍的配方进行了分析和研究,并根据化学镀镍反应机理的电化学理论,揭示了化学镀镍磷合金实验过程的电化学本质。

The chemical plating nickel formula was analyzed and studied by orthogonal designed method.Furthermore, according to the electrochemical theory on the chemical plating nickel reaction mechanism,the electrochemical essence of the chemical plating nickel-phosphorus alloy experiments were revealed.