摘要
介绍了电子产品用无铅焊料发展的背景,分析了无铅焊料研究必须解决的若干重要问题,重点介绍了对具有应用价值的锡银系和锡锌系无铅焊料的研究现状和发展趋势,并归纳出解决锡锌系无铅焊料润湿性的方法。
Background of researching lead-free solders in microelectronics is introduced. Some important problems of developing lead-free solders are illustrated. Current status and trends in research of SnAg and SnZn lead-free solders with more potential applications are described in details. Methods of developing wettability of SnZn alloys are summarized.
出处
《机械工程材料》
CAS
CSCD
北大核心
2005年第3期11-13,21,共4页
Materials For Mechanical Engineering
关键词
无铅焊料
润湿性
蠕变
lead-free solder
wettability
creeping
